AMD Instinct MI300X GPU#
The AMD Instinct™ MI300X GPU represents a significant leap in data center GPU design, purpose-built for large-scale AI inference, high-throughput LLM workloads, and advanced HPC deployments. Featuring cutting-edge CDNA™ 3 architecture and industry-leading memory capacity, the MI300X is designed to meet the most demanding compute and memory bandwidth requirements of today’s generative AI era.
This documentation provides a comprehensive guide for users, system integrators, and infrastructure teams working with the MI300X, covering the complete software and runtime configuration lifecycle — from initial bring-up and partitioning to troubleshooting and running real-world workload.
Key technical highlights of the MI300X include:
Up to 192 GB of HBM3 memory with ultra-high bandwidth to accelerate large model inference.
Support for advanced GPU partitioning modes, enabling logical GPU segmentation (SPX, CPX) for multi-tenant deployments and workload isolation.
Fine-grained memory partitioning (NPS1, NPS4) for optimizing memory locality and performance in dense compute clusters.
Full-stack compatibility with ROCm 6.x, the open software platform for AMD GPUs, enabling tight integration with PyTorch, Hugging Face, and other AI/ML frameworks.
The sections below provide targeted guidance for each step of working with the MI300X platform:
Overview — Architectural deep dive and partitioning model explanation.
Requirements — Platform prerequisites, supported ROCm versions, and kernel/BIOS configurations.
Quick Start Guide — Step-by-step instructions to configure GPU and memory partitions using amd-smi.
Troubleshooting — Common error resolutions and best practices for debugging partitioning-related issues.
Run a VLLM workload — Instructions for deploying a high-throughput LLM inference pipeline on MI300X.
Whether you’re deploying MI300X at scale in a hyperscaler data center or integrating it into an on-prem AI cluster, this guide is your central reference for maximizing performance, stability, and resource efficiency.